Hornet3d
Wise
The two most popular methods were a small drop about half the size of a pea on the center of the processors. This gets compressed to a thin film as the heat sink is pressed down. Second method was the same amount but spread across the processor, either with the card provided with some thermal compounds or an old credit card. The end result was much the same. I always used the second method and I have systems here I built over ten years ago that are still used in a network.
It should be remembered that the whole point is to even out the microscopic indentations on the top of the processor it is not there ti insulate it. The compound allows the heat sink to have the best thermal contact between the processor and the base of the heat sink. It the compound should always be removed and replaced if the heat sink is removed as it is impossible to seat the heat sink in precisely that same position on refitting.
It should be remembered that the whole point is to even out the microscopic indentations on the top of the processor it is not there ti insulate it. The compound allows the heat sink to have the best thermal contact between the processor and the base of the heat sink. It the compound should always be removed and replaced if the heat sink is removed as it is impossible to seat the heat sink in precisely that same position on refitting.